Composite heat sink
Composite heat sink optimized for thermal expansion with thermal conductivity of 1000 W/mK.
This is a super high thermal conductivity heat sink that combines core material TPG with a thermal conductivity of 1500 W/mK and capsule material optimized for thermal expansion. It is suitable for packaging high-power, high-frequency semiconductor chips.
- 企業：モメンティブ・テクノロジーズ・ジャパン
- 価格：Other
